The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Aug. 19, 2016
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Jung Ho Hwang, Seoul, KR;

Han Su Lee, Seoul, KR;

Dae Young Choi, Seoul, KR;

Soon Gyu Kwon, Seoul, KR;

Dong Hun Jeong, Seoul, KR;

In Ho Jeong, Seoul, KR;

Kil Dong Son, Seoul, KR;

Sang Hwa Kim, Seoul, KR;

Sang Young Lee, Seoul, KR;

Jae Hoon Jeon, Seoul, KR;

Jin Hak Lee, Seoul, KR;

Yun Mi Bae, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/09 (2013.01); H05K 3/108 (2013.01); H05K 3/244 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/098 (2013.01); H05K 2203/0588 (2013.01); H05K 2203/1184 (2013.01);
Abstract

Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.


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