The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Sep. 30, 2014
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Shankar S. Pennathur, San Jose, CA (US);

Carlos A. S. Ribas, Los Altos, CA (US);

Deniz Teoman, San Mateo, CA (US);

Michael Eng, San Jose, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/31 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01); G06F 1/20 (2006.01); H01L 23/36 (2006.01); H01L 23/433 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0212 (2013.01); G06F 1/20 (2013.01); H01L 23/3128 (2013.01); H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 23/4334 (2013.01); H01L 23/552 (2013.01); H05K 1/023 (2013.01); H05K 1/0203 (2013.01); H05K 3/284 (2013.01); H05K 3/303 (2013.01); H01L 23/3121 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A compact portable electronic device packaged into a System-in-Package assembly and thermal solutions for the device is disclosed. The compact portable electronic device can be assembled into a single package to reduce size and enhance form factor. Several tens or hundreds of components including multiple dies, passive components, mechanical or optical components can be packaged into a single system on a printed circuit board. One or more of the components can dissipate a lot of power resulting in the generation of excess heat. To remove the excess heat, the device can include one or more thermal solutions such as internal thermal plugs, heat spreaders, internal embedded heat sinks, and/or external heat sinks. In some examples, the thermal solutions can dissipate heat via conduction to the bottom of the substrate or via convection to the top of the system or a combination of both.


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