The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Sep. 07, 2016
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Sung-il Kim, Yongin-si, KR;
Si-ho Jang, Seongnam-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-Si, KR;
Abstract
A hot stamping wiring includes a hot stamping film that has insulation properties and can be attached to an insulating part by a hot stamping method, an electronic device having a hot stamping and a hot stamping method are provided. The hot stamping wiring includes a plurality of band-shaped conductors that are formed in a band shape of a material having electrical conductivity, attachable to a surface of the hot stamping film in a lengthwise direction of the hot stamping film, and are spaced apart at intervals, and a connector wafer, which includes a plurality of connecting pins corresponding to the plurality of band-shaped conductors, is disposed at the hot stamping film, and is attached to the insulating part by ultrasonic welding, wherein the connector wafer comprises a plurality of junction projections for ultrasonic welding.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile