The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Oct. 27, 2015
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Mitsuhiko Ueda, Osaka, JP;

Yoshiharu Sanagawa, Osaka, JP;

Takanori Aketa, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/38 (2010.01); H01L 33/56 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/38 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.


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