The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Jun. 10, 2011
Applicants:

Johann Ramchen, Altdorf, DE;

David Racz, Regensburg, DE;

Hans-christoph Gallmeier, Regensburg, DE;

Stefan Grötsch, Bad Abbach, DE;

Simon Jerebic, Tegernheim, DE;

Inventors:

Johann Ramchen, Altdorf, DE;

David Racz, Regensburg, DE;

Hans-Christoph Gallmeier, Regensburg, DE;

Stefan Grötsch, Bad Abbach, DE;

Simon Jerebic, Tegernheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/227 (2006.01); H01L 33/60 (2010.01); H01L 33/46 (2010.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 31/0232 (2014.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 25/16 (2006.01); H01L 23/60 (2006.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 23/295 (2013.01); H01L 33/46 (2013.01); H01L 23/3121 (2013.01); H01L 23/60 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 31/0232 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/05032 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/181 (2013.01);
Abstract

An optoelectronic semiconductor component includes a carrier and at least one optoelectronic semiconductor chip mounted on the carrier top. The semiconductor component includes at least one bonding wire, via which the semiconductor chip is electrically contacted, and at least one covering body mounted on a main radiation side and projects beyond the bonding wire. At least one reflective potting compound encloses the semiconductor chip laterally and extends at least as far as the main radiation side of the semiconductor chip. The bonding wire is covered completely by the reflective potting compound or completely by the reflective potting compound together with the covering body.


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