The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Apr. 24, 2015
Applicant:

Vanguard International Semiconductor Corporation, Hsinchu, TW;

Inventors:

Chien-Hsien Song, Kaohsiung, TW;

Chung-Ren Lao, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7823 (2013.01); H01L 29/0882 (2013.01); H01L 29/404 (2013.01); H01L 29/42356 (2013.01); H01L 29/66681 (2013.01); H01L 29/7835 (2013.01); H01L 29/7836 (2013.01);
Abstract

A semiconductor device including a substrate having a drain region therein is provided. A gate-electrode layer is disposed on the drain region. A first field-plate conductor is disposed on the substrate and overlaps the drain region. A gap is located laterally between the first field-plate conductor and the gate-electrode layer. A second field-plate conductor covers the first field-plate conductor and the gap. The second field-plate conductor is separated from the first field-plate conductor. A method for forming the semiconductor device is also provided.


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