The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Apr. 18, 2016
Applicant:

Willard & Kelsey Solar Group, Llc, Perrysburg, OH (US);

Inventors:

James E. Heider, Bowling Green, OH (US);

Michael J. Cicak, Perrysburg, OH (US);

Leo Adoline, Jr., Temperance, MI (US);

Gary T. Faykosh, Perrysburg, OH (US);

Assignee:

WILLARD & KELSEY SOLAR GROUP, LLC, Perrysburg, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/46 (2006.01); H01L 29/06 (2006.01); B65G 49/06 (2006.01); C23C 14/50 (2006.01); C23C 14/56 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0657 (2013.01); B65G 49/066 (2013.01); C23C 14/50 (2013.01); C23C 14/566 (2013.01); C23C 16/458 (2013.01); C23C 16/46 (2013.01); H01L 21/6776 (2013.01); H01L 21/67236 (2013.01); H01L 21/67706 (2013.01); H01L 21/67712 (2013.01); H01L 21/67721 (2013.01); H01L 21/67754 (2013.01); H01L 21/68707 (2013.01); H01L 29/0649 (2013.01); B65G 2249/02 (2013.01);
Abstract

A glass sheet semiconductor deposition system () for coating semiconductor material on glass sheets is performed by conveying the glass sheets vertically suspended at upper extremities thereof by a pair of conveyors () through a housing () including a vacuum chamber (). The glass sheets are conveyed on shuttles () through an entry load station () into the housing vacuum chamber (), through a heating station () and at least one semiconductor deposition station () in the housing (), and to a cooling station () prior to exiting of the system through an exit load lock station (). The semiconductor deposition station construction includes a deposition module () and a radiant heater () between which the vertical glass sheets are conveyed for the semiconductor deposition.


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