The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Dec. 07, 2015
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Takuo Funaya, Tokyo, JP;

Hiromi Shigihara, Tokyo, JP;

Hisao Shigihara, Tokyo, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Kawasaki-shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 23/495 (2006.01); H01L 23/522 (2006.01); H01L 27/06 (2006.01); H01L 27/12 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01L 23/49575 (2013.01); H01L 23/5227 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/49 (2013.01); H01L 27/0617 (2013.01); H01L 27/1203 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/4945 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/10161 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A semiconductor device includes a semiconductor substrate having a main surface; a first coil formed on the main surface; a first insulating film formed over the first coil and having a first main surface; a second insulating film formed on the first main surface of the first insulating film and having a second main surface; and a second coil formed on the second main surface of the second insulating film, wherein the first main surface of the first insulating film has a first area on which the second insulating film is formed, and has a second area without the first area in a plan view, and wherein the second insulating film is surrounded with the second area in the plane view.


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