The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

May. 09, 2016
Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventor:

Jen-Tsorng Chang, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/683 (2006.01); G02F 1/1335 (2006.01); G02F 1/1368 (2006.01); H01L 21/78 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1266 (2013.01); G02F 1/1368 (2013.01); G02F 1/133514 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 27/1218 (2013.01); H01L 27/1259 (2013.01); G02F 2001/133302 (2013.01); G02F 2202/28 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); Y10T 428/24273 (2015.01); Y10T 428/24777 (2015.01);
Abstract

A supporting device includes a main body and a ring-shaped glue layer. The main body includes a top surface and a bottom surface opposite to the top surface. The top surface defines a first groove. The first groove is substantially ring-shaped. The glue layer is arranged in the top surface and surrounds the first groove. A plurality of glass-frits is distributed in the glue layer. A thickness of the main body is approximately in a range from 0.5 millimeters to 0.8 millimeters. The glue layer is directly attached the top surface.


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