The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Apr. 07, 2016
Applicant:

SK Hynix Inc., Gyeonggi-do, KR;

Inventor:

Yeonghun Lee, Gyeonggi-do, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/535 (2006.01); H01L 27/115 (2017.01); H01L 27/11582 (2017.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/76897 (2013.01); H01L 23/535 (2013.01);
Abstract

There are provided a 3-D semiconductor device and a manufacturing method thereof. The 3-D semiconductor device includes a substrate extending along a first plane defined by first and second x and y directions, the substrate having a pipe transistor formed therein, a plurality of word lines spaced apart at regular intervals along a third direction z perpendicular to the first and second x and y directions; a first vertical plug connected to a first end of the pipe transistor by passing vertically through the word lines; a second vertical plug, connected to a second end of the pipe transistor by passing vertically through the word lines; a bit line connected to a top surface of the first vertical plug; and a source line connected to a top surface of the second vertical plug, wherein the first and second vertical plugs have different size.


Find Patent Forward Citations

Loading…