The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Mar. 08, 2016
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventor:

Yoshihiro Akutsu, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 27/115 (2017.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 27/115 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01);
Abstract

In general, according to one embodiment, a semiconductor memory device includes a first conductive layer, a second conductive layer, a first sub-conductive layer, a first insulating film. One portion of the first conductive layer overlaps at least one portion of the first sub-conductive layer in the first direction. One other portion of the first conductive layer overlaps at least one portion of the second conductive layer in the first direction. One portion of the first insulating film overlaps at least one portion of the second conductive layer in the second direction. The One portion of the first insulating film overlaps one portion of the first sub-conductive layer in the second direction. The second conductive layer overlap one other portion of the first insulating film in a direction intersecting the second direction.


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