The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Feb. 24, 2016
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Charles C. Bureau, Bromont, CA;
Eric Duchesne, Granby, CA;
Kang-Wook Lee, Yorktown Heights, NY (US);
Isabelle Paquin, Bromont, CA;
Dragoljub Veljanovic, Granby, CA;
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/17 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81911 (2013.01); H01L 2224/81948 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/06 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/20102 (2013.01); H01L 2924/20103 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20105 (2013.01);
Abstract
An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.