The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Apr. 28, 2016
Applicant:
Thales, Courbevoie, FR;
Inventor:
Philippe Kertesz, Rueil Malmaison, FR;
Assignee:
THALES, Courbevoie, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/66 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/60 (2006.01); H01L 23/24 (2006.01); H01L 21/54 (2006.01); H05K 1/18 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/54 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 23/24 (2013.01); H01L 23/293 (2013.01); H01L 23/3128 (2013.01); H01L 23/3675 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 23/60 (2013.01); H01L 24/17 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/50 (2013.01); H01L 24/83 (2013.01); H01L 23/36 (2013.01); H01L 23/4985 (2013.01); H01L 23/49816 (2013.01); H01L 23/564 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/302 (2013.01); H01L 2924/3025 (2013.01); H05K 1/186 (2013.01);
Abstract
A component comprises at least one support on which is fixed at least one electronic circuit, for example a circuit of MMIC type, one or more layers of organic materials stacked on the support according to a technique of printed circuit type and forming a pre-existing cavity containing the electronic circuit, the cavity being filled with a material of low permeability to water vapor such as LCP.