The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Oct. 18, 2012
Applicant:

Ford Global Technologies, Llc, Dearborn, MI (US);

Inventors:

Larry Dean Elie, Ypsilanti, MI (US);

Allan Roy Gale, Livonia, MI (US);

John Matthew Ginder, Plymouth, MI (US);

Clay Wesley Maranville, Ypsilanti, MI (US);

Assignee:

Ford Global Technologies, LLC, Dearborn, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01B 3/10 (2006.01); H01B 1/02 (2006.01); C25D 11/04 (2006.01); C25D 11/12 (2006.01); C25D 11/18 (2006.01);
U.S. Cl.
CPC ...
H01B 3/105 (2013.01); C25D 11/04 (2013.01); C25D 11/12 (2013.01); C25D 11/18 (2013.01); H01B 1/026 (2013.01); H01B 7/0009 (2013.01);
Abstract

An insulated electric conductor having a copper core, a layer of aluminum formed on the copper core, and a second layer of aluminum in the form of high-purity aluminum is disclosed. The copper core may be a solid core or may be formed from a plurality of copper strands. The layer of aluminum formed over the copper core is at least partially anodized to form an aluminum oxide dielectric layer. The layer of high-purity aluminum may be formed by evaporation deposition, sputter deposition, or co-extrusion. Once the layer of high-purity aluminum is formed, it is anodized. More than two layers of aluminum may be formed over the copper core.


Find Patent Forward Citations

Loading…