The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Nov. 21, 2014
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Richard Fix, Weil im Schoenbuch, DE;

Rene Hartke, Aranjuez, ES;

Jochen Beintner, Reutlingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 1/10 (2006.01); G01N 21/3504 (2014.01); G01N 21/359 (2014.01); G01N 21/39 (2006.01); H01S 5/00 (2006.01); H01S 5/026 (2006.01); H01S 5/06 (2006.01); H01S 5/183 (2006.01);
U.S. Cl.
CPC ...
G01N 21/3504 (2013.01); G01N 21/359 (2013.01); G01N 21/39 (2013.01); H01S 5/0028 (2013.01); H01S 5/0264 (2013.01); H01S 5/0607 (2013.01); H01S 5/18361 (2013.01); G01N 2201/0612 (2013.01); H01S 5/18363 (2013.01);
Abstract

A method for producing an integrated micromechanical fluid sensor component includes forming a first wafer with a first Bragg reflector and with a light-emitting device on a first substrate. The light-emitting device is configured to emit light rays in an emission direction from a surface of the light-emitting device facing away from the first Bragg reflector. The method further includes forming a second wafer with a second Bragg reflector and with a photodiode on a second substrate. The photodiode is arranged on a surface of the second Bragg reflector facing towards the second substrate. The method also includes bonding or gluing the first wafer to the second wafer such that there is formed a cavity into which a fluid is introduced and through which the light rays can pass. The method further includes separating the fluid sensor component from the first and the second wafer.


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