The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Oct. 10, 2014
Applicant:
Stretchsense Limited, Auckland, NZ;
Inventors:
Benjamin Marc O'Brien, Auckland, NZ;
Todd Alan Gisby, Auckland, NZ;
Antoni Edward Harbuz, Auckland, NZ;
Samuel Schlatter, Auckland, NZ;
Assignee:
Stretchsense Limited, Penrose, Auckland, NZ;
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/00 (2006.01); G01B 7/16 (2006.01); G01L 1/14 (2006.01); A61N 1/36 (2006.01); G01L 1/20 (2006.01); B32B 7/06 (2006.01); B32B 7/12 (2006.01); B32B 7/04 (2006.01); B32B 37/10 (2006.01); B32B 37/16 (2006.01); B32B 38/10 (2006.01); A61N 1/08 (2006.01); B32B 37/00 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
G01B 7/18 (2013.01); A61N 1/36014 (2013.01); B32B 7/045 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 37/0076 (2013.01); B32B 37/025 (2013.01); B32B 37/10 (2013.01); B32B 37/16 (2013.01); B32B 38/10 (2013.01); G01B 7/22 (2013.01); G01L 1/14 (2013.01); G01L 1/142 (2013.01); G01L 1/20 (2013.01); A61N 1/08 (2013.01); B32B 37/003 (2013.01); B32B 37/12 (2013.01); B32B 2307/202 (2013.01); B32B 2307/204 (2013.01); B32B 2307/51 (2013.01); B32B 2457/00 (2013.01); B32B 2535/00 (2013.01);
Abstract
In one aspect the invention provides a method of fabricating a laminate of flexible and compliant layers of material, such as used to provide a dielectric elastomer sensor. According to the method a flexible and compliant layer of material which is affixed to a substrate to avoid strain during processing is bonded to another layer of flexible and compliant material and released from the substrate to form a laminate. The layer of flexible and compliant material affixed to the substrate may be inspected prior to bonding.