The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Jul. 30, 2015
Applicants:
Scott M. Zimmerman, Basking Ridge, NJ (US);
William R. Livesay, San Diego, CA (US);
Richard L. Ross, Del Mar, CA (US);
Inventors:
Scott M. Zimmerman, Basking Ridge, NJ (US);
William R. Livesay, San Diego, CA (US);
Richard L. Ross, Del Mar, CA (US);
Assignee:
Goldeneye, Inc., San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/18 (2006.01); C30B 25/10 (2006.01); C30B 25/06 (2006.01); C30B 23/08 (2006.01); C30B 23/02 (2006.01); C30B 19/12 (2006.01); C30B 29/06 (2006.01); C30B 29/08 (2006.01); C30B 29/52 (2006.01); C30B 29/42 (2006.01); C30B 29/40 (2006.01); C30B 29/16 (2006.01); H01L 31/0304 (2006.01); H01L 31/028 (2006.01); H01L 31/0296 (2006.01); H01L 31/036 (2006.01); H01L 31/0693 (2012.01); H01L 31/0687 (2012.01); H01L 31/0735 (2012.01); H01L 31/074 (2012.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01L 31/0725 (2012.01); C30B 25/02 (2006.01); H01L 31/054 (2014.01);
U.S. Cl.
CPC ...
C30B 25/186 (2013.01); C30B 19/12 (2013.01); C30B 23/025 (2013.01); C30B 23/08 (2013.01); C30B 25/02 (2013.01); C30B 25/06 (2013.01); C30B 25/105 (2013.01); C30B 29/06 (2013.01); C30B 29/08 (2013.01); C30B 29/16 (2013.01); C30B 29/40 (2013.01); C30B 29/403 (2013.01); C30B 29/406 (2013.01); C30B 29/42 (2013.01); C30B 29/52 (2013.01); H01L 31/028 (2013.01); H01L 31/0296 (2013.01); H01L 31/0304 (2013.01); H01L 31/036 (2013.01); H01L 31/03044 (2013.01); H01L 31/0547 (2014.12); H01L 31/0687 (2013.01); H01L 31/0693 (2013.01); H01L 31/074 (2013.01); H01L 31/0725 (2013.01); H01L 31/0735 (2013.01); H01L 31/18 (2013.01); H01L 31/184 (2013.01); H01L 31/1804 (2013.01); H01L 31/1808 (2013.01); H01L 31/1812 (2013.01); H01L 31/1844 (2013.01); H01L 31/1848 (2013.01); H01L 31/1856 (2013.01); H01L 31/1892 (2013.01); H01L 33/0054 (2013.01); H01L 33/0062 (2013.01); H01L 33/0075 (2013.01); H01L 33/0083 (2013.01); Y02E 10/52 (2013.01); Y02E 10/544 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11); Y10T 428/31678 (2015.04);
Abstract
Thin freestanding nitride veneers can be used for the fabrication of semiconductor devices. These veneers are typically less than 100 microns thick. The use of thin veneers also eliminates the need for subsequent wafer thinning for improved thermal performance and 3D packaging.