The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Sep. 08, 2016
Applicant:

Hitachi Kokusai Electric Inc., Tokyo, JP;

Inventors:

Hiroshi Ashihara, Toyama, JP;

Motoshi Sawada, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 14/50 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); H01L 21/687 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4405 (2013.01); C23C 14/50 (2013.01); C23C 16/4401 (2013.01); C23C 16/4408 (2013.01); C23C 16/4409 (2013.01); C23C 16/4412 (2013.01); C23C 16/4583 (2013.01); C23C 16/45565 (2013.01); C23C 16/45587 (2013.01); C23C 16/45591 (2013.01); H01J 37/32871 (2013.01); H01L 21/68764 (2013.01); H01L 21/68792 (2013.01);
Abstract

A substrate processing apparatus includes: a process container where a substrate is processed; a process gas supply unit configured to supply a process gas into the process container; a substrate placing table installed in the process container; a shaft penetrating a hole at a bottom portion of the process container and coupled to the substrate placing table; a bellows surrounding the shaft and disposed outside of the process container wherein an inner space thereof is in communication with a space of the process container; an inert gas supply system configured to supply an inert gas into the inner space of the bellows disposed outside of the process container; and a component falling prevention unit including at least a first structure disposed along a first portion of the hole at the bottom of the process container and a second structure disposed along a second portion of the hole adjacent to the first structure.


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