The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Mar. 23, 2017
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); F21V 11/00 (2015.01); C08L 33/00 (2006.01); H01L 33/58 (2010.01); C09D 133/00 (2006.01); C09D 7/12 (2006.01); G02B 5/02 (2006.01); G02B 1/04 (2006.01); F21V 29/87 (2015.01); F21V 9/00 (2015.01); H01L 33/54 (2010.01); F21V 9/02 (2006.01); H01L 33/56 (2010.01); H01L 33/52 (2010.01); F21V 9/04 (2006.01); F21V 9/06 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
C08L 33/00 (2013.01); C09D 7/1283 (2013.01); C09D 7/1291 (2013.01); C09D 133/00 (2013.01); F21V 9/00 (2013.01); F21V 9/02 (2013.01); F21V 9/04 (2013.01); F21V 9/06 (2013.01); F21V 29/87 (2015.01); G02B 1/04 (2013.01); G02B 5/0242 (2013.01); G02B 5/0278 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/14 (2013.01); C08L 2205/22 (2013.01); F21Y 2115/10 (2016.08);
Abstract
A light diffuser includes: a thermoplastic resin base which has a thermal expansion coefficient of at least 4×10/K and at most 8×10/K; and a light diffusion layer which is disposed on a surface of the thermoplastic resin base and includes an acrylic resin film and an acrylic resin particle, the acrylic resin film including one or more acrylic resins having a glass transition temperature of at least 30° C. and at most 50° C., the acrylic resin particle being included in the acrylic resin film and having an average particle size of at least 1 μm and at most 15 μm.