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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9815924 B1

PDFFull Text
Date of Patent:
Nov. 14, 2017

Filed:

Dec. 24, 2013

Encapsulant film

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Sung Ho Choi, Daejeon, KR;

Choong Hoon Lee, Daejeon, KR;

Ji Yoon Woo, Daejeon, KR;

Hyo Ju Kim, Daejeon, KR;

Jin Sam Gong, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Brent O'Hern

Int. Cl.
CPC ...
H01L 31/048 (2014.01); C08F 210/16 (2006.01); C08L 51/00 (2006.01); C08K 5/132 (2006.01); C08K 5/134 (2006.01); C08K 5/52 (2006.01); C08J 5/18 (2006.01); H01L 31/18 (2006.01); H01L 31/049 (2014.01); C08L 23/08 (2006.01); C08K 5/544 (2006.01); C08L 23/00 (2006.01); C08F 255/02 (2006.01); C08F 8/42 (2006.01); C08L 51/06 (2006.01); H01L 23/29 (2006.01); C09J 151/06 (2006.01); C08K 5/14 (2006.01); C08K 5/5425 (2006.01); C09D 143/04 (2006.01); C09D 151/06 (2006.01);
U.S. Cl.
CPC ...
C08F 210/16 (2013.01); C08F 8/42 (2013.01); C08F 255/02 (2013.01); C08J 5/18 (2013.01); C08K 5/132 (2013.01); C08K 5/1345 (2013.01); C08K 5/14 (2013.01); C08K 5/52 (2013.01); C08K 5/544 (2013.01); C08K 5/5425 (2013.01); C08L 23/00 (2013.01); C08L 23/08 (2013.01); C08L 23/0815 (2013.01); C08L 51/003 (2013.01); C08L 51/06 (2013.01); C09D 143/04 (2013.01); C09D 151/06 (2013.01); C09J 151/06 (2013.01); H01L 23/29 (2013.01); H01L 23/296 (2013.01); H01L 31/048 (2013.01); H01L 31/049 (2014.12); H01L 31/0481 (2013.01); H01L 31/18 (2013.01); C08J 2323/08 (2013.01); C08J 2451/08 (2013.01); C08L 2203/204 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01); H01L 2924/0002 (2013.01); Y02E 10/20 (2013.01); Y02E 10/50 (2013.01);
Abstract

Embodiments of the present application relate to an encapsulant film, a method for manufacturing an encapsulant film, an optoelectronic device, and a method for manufacturing an optoelectronic device, and can provide superior adhesive force with a front substrate and a back sheet, and specifically having long-term adhesive and heat resistance properties. Also, the present application can provide the encapsulant which does not have a negative effect on parts, such as optoelectronic elements or wire electrodes encapsulated in the optoelectronic devices, and on a working environment, and which can maintain superior workability and economic feasibility in device manufacturing.

Find Patent Forward Citations

Choi, Sung. (2017). Encapsulant film (U.S. Patent No. 9815924). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9815924

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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