The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Oct. 31, 2014
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Sasha Marjanovic, Painted Post, NY (US);

Albert Roth Nieber, Painted Post, NY (US);

Garrett Andrew Piech, Corning, NY (US);

Sergio Tsuda, Horseheads, NY (US);

Robert Stephen Wagner, Corning, NY (US);

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 33/09 (2006.01); C03B 33/02 (2006.01); C03B 33/08 (2006.01); C03B 33/10 (2006.01); C03B 23/02 (2006.01); C03B 33/033 (2006.01); C03B 23/023 (2006.01); C03B 23/025 (2006.01); B23K 26/00 (2014.01); B23K 26/402 (2014.01); B23K 26/0622 (2014.01); B23K 26/53 (2014.01); B23K 26/08 (2014.01); C03B 33/023 (2006.01); C03B 33/04 (2006.01); B23K 103/16 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
C03B 33/091 (2013.01); B23K 26/0057 (2013.01); B23K 26/0087 (2013.01); B23K 26/0622 (2015.10); B23K 26/0624 (2015.10); B23K 26/0884 (2013.01); B23K 26/402 (2013.01); B23K 26/53 (2015.10); C03B 23/02 (2013.01); C03B 23/023 (2013.01); C03B 23/025 (2013.01); C03B 33/0222 (2013.01); C03B 33/033 (2013.01); C03B 33/082 (2013.01); C03B 33/102 (2013.01); B23K 2203/172 (2015.10); B23K 2203/54 (2015.10); B65G 2249/04 (2013.01); C03B 33/023 (2013.01); C03B 33/04 (2013.01); Y02P 40/57 (2015.11); Y10T 428/15 (2015.01); Y10T 428/24777 (2015.01);
Abstract

Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a COlaser for fully automated separation.


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