The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Feb. 21, 2012
Applicants:

Gerhard Kalkowski, Jena, DE;

Carolin Rothhardt, Jena, DE;

Mathias Rohde, Bad Klosterlausnitz, DE;

Ramona Eberhardt, Bucha, DE;

Inventors:

Gerhard Kalkowski, Jena, DE;

Carolin Rothhardt, Jena, DE;

Mathias Rohde, Bad Klosterlausnitz, DE;

Ramona Eberhardt, Bucha, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/14 (2006.01); B23K 20/24 (2006.01); C03B 23/20 (2006.01); C03C 27/06 (2006.01); C04B 35/645 (2006.01); C04B 37/00 (2006.01); H01L 21/20 (2006.01); B23K 20/02 (2006.01);
U.S. Cl.
CPC ...
B32B 37/14 (2013.01); B23K 20/02 (2013.01); B23K 20/24 (2013.01); C03B 23/20 (2013.01); C03C 27/06 (2013.01); C04B 35/645 (2013.01); C04B 37/005 (2013.01); C04B 37/006 (2013.01); H01L 21/2007 (2013.01); C04B 2235/6581 (2013.01); C04B 2235/963 (2013.01); C04B 2237/06 (2013.01); C04B 2237/12 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/345 (2013.01); C04B 2237/36 (2013.01); C04B 2237/365 (2013.01); C04B 2237/52 (2013.01); C04B 2237/56 (2013.01); C04B 2237/704 (2013.01);
Abstract

The invention relates to a method of joining substrates. It is the object of the invention in this respect to join substrates of substrate materials together without having to exert an increased effort for a coating with additional coating processes to be carried out and to be able to achieve a good quality of the join connection in so doing. In the method in accordance with the invention a pretreatment of at least one join surface of a substrate to be joined is carried out in low pressure oxygen plasma prior to the actual joining. On the joining, a contact force acts on the substrates to be joined in the range 2 kPa to 5 MPa and in this process a heat treatment is carried out at an elevated temperature of at least 100° C. and at under pressure conditions of a maximum of 10 mbar, preferably <10mbar.


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