The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Feb. 28, 2012
Applicants:
Hermann Oppermann, Berlin, DE;
Matthias Hutter, Berlin, DE;
Christian Ehrhardt, Berlin, DE;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B23K 35/362 (2006.01); B23K 35/02 (2006.01); B23K 35/32 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/264 (2013.01); B23K 35/302 (2013.01); B23K 35/3006 (2013.01); B23K 35/3013 (2013.01); B23K 35/3033 (2013.01); B23K 35/322 (2013.01); B23K 35/362 (2013.01); B23K 35/3612 (2013.01); B23K 35/3613 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29318 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32507 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/15787 (2013.01); Y10T 403/479 (2015.01);
Abstract
The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.