The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Sep. 06, 2013
Applicant:

Fujikura Ltd., Koto-ku, Tokyo, JP;

Inventors:

Takeshi Segi, Sakura, JP;

Yusuke Matsuda, Sakura, JP;

Katsuya Yamagami, Sakura, JP;

Kenichi Nakatate, Sakura, JP;

Assignee:

FUJIKURA LTD., Koto-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 1/04 (2006.01); H04N 9/47 (2006.01); A61B 1/005 (2006.01); G02B 23/24 (2006.01); A61B 1/00 (2006.01); H04N 5/225 (2006.01); A61B 1/05 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
A61B 1/005 (2013.01); A61B 1/0011 (2013.01); A61B 1/04 (2013.01); A61B 1/051 (2013.01); G02B 23/2484 (2013.01); H04N 5/2257 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H04N 2005/2255 (2013.01); Y10T 29/49128 (2015.01); Y10T 29/532 (2015.01);
Abstract

An imaging module of the invention includes: an electrical cable; a solid-state image sensing device; and a flexible wiring substrate including: a device-mounted portion onto which the solid-state image sensing device is mounted; two extended portions which bend at both sides of the device-mounted portion and extend from the device-mounted portion so as to come close to each other with increasing distance from the device-mounted portion; two connection end portions extending from the two extended portions along the direction of the axis of the front end of the electrical cable on an opposite side of the device-mounted portion; and terminals which are provided on the two connection end portions and connected to the electrical cable, the flexible wiring substrate electrically connecting the solid-state image sensing device and the electrical cable.


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