The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Feb. 25, 2015
Applicant:

Lexmark International, Inc., Lexington, KY (US);

Inventors:

Keith Bryan Hardin, Lexington, KY (US);

Paul Kevin Hall, Lexington, KY (US);

Qing Zhang, Lexington, KY (US);

John Thomas Fessler, Lexington, KY (US);

Assignee:

Lexmark International, Inc., Lexington, KY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/30 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/301 (2013.01); H05K 1/0222 (2013.01); H05K 1/184 (2013.01); H05K 3/306 (2013.01); H05K 3/4046 (2013.01); H05K 1/0231 (2013.01); H05K 1/0233 (2013.01); H05K 1/0251 (2013.01); H05K 1/0298 (2013.01); H05K 2201/09645 (2013.01); H05K 2201/09809 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10893 (2013.01); H05K 2201/10984 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49135 (2015.01);
Abstract

A method for forming a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example includes filling a first cavity having a tapered surface with a body material. A first layer of a constraining material is provided on top of the first cavity and has a second cavity having a width that is smaller than the first cavity. The second cavity is filled with the body material. Successive layers of the constraining material are provided on top of the first layer of the constraining material. Cavities of the successive layers of the constraining material are selectively filled with at least the body material to form layers of the main body portion of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.


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