The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Feb. 27, 2015
Sony Corporation, Tokyo, JP;
Toshihiko Watanabe, Tokyo, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
A mounting substrate includes a through-holeformed in a substrate, a first land part, a second land part, a first component attaching part, a second component attaching part, a conductive layer, and a filling memberfilled into a part of the through-hole. A shortest distance allowable value Lfrom the center of the first land partto a componentis determined on the basis of the volume Vof a part of the through-holepositioned above a top surface of the filling memberon the side of the first land part, the length Lof the componentto be mounted to the first component attaching part, and the maximum allowable value of the inclination of the componentto be mounted to the first component attaching partrelative to the first surfaceof the substrate