The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Jun. 16, 2016
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Yong Seok Cho, Seoul, KR;
Chang Sung Kim, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 1/0209 (2013.01); H05K 1/09 (2013.01); H05K 3/4644 (2013.01); H05K 1/0227 (2013.01); H05K 3/28 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09881 (2013.01);
Abstract
Disclosed is a printed circuit board. The printed circuit board includes an insulating layer, a copper foil formed on the insulating layer and formed therein with a groove to expose a portion of a top surface of the insulating layer, and a thermal conductive layer filled in the groove.
Cho, Yong. (2017). Printed circuit board and method of fabricating the same (U.S. Patent No. 9814129). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9814129
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile