The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Feb. 10, 2017
Applicant:

Bose Corporation, Framingham, MA (US);

Inventors:

Lei Cheng, Wellesley, MA (US);

Ellen I. Searl, Charlton, MA (US);

Joseph Jankovsky, Holliston, MA (US);

Assignee:

BOSE CORPORATION, Framingham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 1/10 (2006.01); H04R 1/02 (2006.01);
U.S. Cl.
CPC ...
H04R 1/1016 (2013.01); H04R 1/023 (2013.01); H04R 1/105 (2013.01); H04R 1/1058 (2013.01); H04R 2460/01 (2013.01);
Abstract

An in-ear headphone comprises an earbud body constructed and arranged for positioning in an ear canal of a wearer, and configured to have a distal end farther into the ear canal than a proximal end. The earbud body includes a cavity and an opening to the cavity. The in-ear headphone further comprises a transducer in the opening to the cavity, a portion of the transducer facing outward from the opening; a microphone at the distal end of the earbud body; an earbud tip on the earbud body and complying with a surface of the earbud body; and an acoustically resistive mesh structure at a distal end of the earbud tip. The mesh structure covers the microphone and the portion of the transducer facing outward from the opening.


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