The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9813790 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 07, 2017

Filed:

Jan. 26, 2017
Applicants:

Rui Zhang, Shenzhen, CN;

Ting Kang, Shenzhen, CN;

Inventors:

Rui Zhang, Shenzhen, CN;

Ting Kang, Shenzhen, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/02 (2006.01); H04R 1/06 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 1/028 (2013.01); H04R 1/06 (2013.01); H04R 19/04 (2013.01); H04R 2201/003 (2013.01);
Abstract

A microphone package includes a housing; a control circuit chip accommodated in the housing; a micro-electromechanical chip accommodated in the housing; and a circuit board forming an accommodation space with the housing. The circuit board includes a substrate, a rigid conductive layer disposed on the substrate and a plurality of conductive pads on the substrate for connecting to the control circuit chip. The micro-electromechanical chip and the control circuit chip are mounted on the rigid conductive layer, and the rigid conductive layer is provided with a number of isolation holes for receiving the conductive pads.


Find Patent Forward Citations

Zhang, Rui. (2017). Microphone package (U.S. Patent No. 9813790). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9813790

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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