The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Dec. 28, 2014
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Anthony Francis Quaglietta, Methuen, MA (US);

Mark M. Doherty, Westford, MA (US);

Lui Lam, Lexington, MA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/30 (2006.01); H03F 3/19 (2006.01); H03F 3/21 (2006.01); H03F 1/02 (2006.01); H03F 3/72 (2006.01);
U.S. Cl.
CPC ...
H03F 1/30 (2013.01); H03F 1/0261 (2013.01); H03F 3/19 (2013.01); H03F 3/211 (2013.01); H03F 3/72 (2013.01); H03F 2200/447 (2013.01); H03F 2200/451 (2013.01); H03F 2203/21131 (2013.01); H03F 2203/21145 (2013.01);
Abstract

Devices and methods related to embedded sensors for dynamic error vector magnitude corrections. In some embodiments, a power amplifier (PA) can include a PA die and an amplification stage implemented on the PA die. The amplification stage can include an array of amplification transistors, with the array being configured to receive and amplify a radio-frequency (RF) signal. The PA can further include a sensor implemented on the PA die. The sensor can be positioned relative to the array of amplification transistors to allow sensing of an operating condition representative of at least some of the amplification transistors. The sensor can be substantially isolated from the RF signal.


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