The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Sep. 20, 2016
Applicant:

Silicon Laboratories Inc., Austin, TX (US);

Inventor:

Timothy J. Dupuis, Austin, TX (US);

Assignee:

Silicon Laboratories Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 7/537 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 25/00 (2006.01); H03F 3/195 (2006.01); H03F 3/213 (2006.01); G01R 19/18 (2006.01);
U.S. Cl.
CPC ...
H02M 7/537 (2013.01); G01R 19/18 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49844 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6616 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/14253 (2013.01); H03F 2200/451 (2013.01);
Abstract

An isolated power transfer device includes a transformer formed in a multi-layer substrate of an integrated circuit package. A primary winding of the transformer is coupled to a first integrated circuit to form a DC/AC power converter and a secondary winding of the transformer is coupled to a second integrated circuit to form an AC/DC power converter. The first and second integrated circuits are electrically isolated from each other. The first integrated circuit includes a lightly doped drain MOSFET integrated with conventional CMOS devices and the second integrated circuit includes a Schottky diode integrated with conventional CMOS devices. The isolated power transfer device includes a capacitive channel for communication of information across an isolation barrier from the second integrated circuit to the first integrated circuit. Capacitors of the capacitive channel may be formed in the multi-layer substrate of the integrated circuit package.


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