The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Apr. 16, 2012
Applicants:

Yuji Shirakata, Chiyoda-ku, JP;

Dai Nakajima, Chiyoda-ku, JP;

Masahiko Fujita, Chiyoda-ku, JP;

Masaki Kato, Chiyoda-ku, JP;

Inventors:

Yuji Shirakata, Chiyoda-ku, JP;

Dai Nakajima, Chiyoda-ku, JP;

Masahiko Fujita, Chiyoda-ku, JP;

Masaki Kato, Chiyoda-ku, JP;

Assignee:

Mitsubishi Electric Corporation, Chiyoda-ku, Tokyo, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 9/00 (2006.01); H02K 11/04 (2016.01); H02P 27/06 (2006.01); H02K 11/05 (2016.01); H02K 5/08 (2006.01); H02K 5/14 (2006.01); H02K 5/22 (2006.01); H02K 15/12 (2006.01); H02K 11/33 (2016.01);
U.S. Cl.
CPC ...
H02K 9/00 (2013.01); H02K 11/046 (2013.01); H02K 11/048 (2013.01); H02K 11/05 (2016.01); H02P 27/06 (2013.01); H02K 5/08 (2013.01); H02K 5/141 (2013.01); H02K 5/225 (2013.01); H02K 11/33 (2016.01); H02K 15/12 (2013.01);
Abstract

Two or more switching devices () and two or more lead frames (, and) are integrally molded by use of a molding resin () so that a power module () is formed; the power module () is made to adhere to a heat sink () via an insulating material (); the power module () and the heat sink () are fixed to a housing () of the power module composite (); the power module composite () is fixed to a case () of an electric rotating machine () via the housing ().


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