The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Aug. 08, 2014
Applicant:
Showa Denko Packaging Co., Ltd., Isehara-shi, Kanagawa, JP;
Inventors:
Yuji Minamibori, Hikone, JP;
Honglin Wang, Hikone, JP;
Assignee:
SHOWA DENKO PACKAGING CO., LTD., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/02 (2006.01); B32B 15/088 (2006.01); B32B 15/085 (2006.01); B32B 15/20 (2006.01); B32B 7/06 (2006.01);
U.S. Cl.
CPC ...
H01M 2/0292 (2013.01); B32B 7/06 (2013.01); B32B 15/085 (2013.01); B32B 15/088 (2013.01); B32B 15/20 (2013.01); H01M 2/0287 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/518 (2013.01); B32B 2307/714 (2013.01); B32B 2307/746 (2013.01); B32B 2323/00 (2013.01); B32B 2375/00 (2013.01); B32B 2377/00 (2013.01); B32B 2439/00 (2013.01); B32B 2457/10 (2013.01); Y10T 428/25 (2015.01); Y10T 428/31544 (2015.04); Y10T 428/31562 (2015.04);
Abstract
In some embodiments, a molding packaging material includes an outer side base layer made of a heat resistant resin, an inner sealant layer, a metal foil layer arranged between the outer side base material layer and the inner sealant layer, and a matte coat layer formed on a side opposite to a metal foil layer side of the outer side base material layer. The matte coat layer includes a resin component, a solid fine particle, and a lubricant, and the inner sealant layer includes a thermoplastic resin and a lubricant.