The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Dec. 08, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Yong-Jun Kim, Suwon-si, KR;

Sung-In Kim, Hwaseong-si, KR;

Jung-Woo Song, Hwaseong-si, KR;

Jae-Rok Kahng, Seoul, KR;

Dae-Won Kim, Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 27/108 (2006.01); H01L 27/24 (2006.01); H01L 29/66 (2006.01); H01L 21/768 (2006.01); H01L 21/74 (2006.01); H01L 27/22 (2006.01); H01L 43/08 (2006.01); H01L 45/00 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4236 (2013.01); H01L 21/743 (2013.01); H01L 21/76897 (2013.01); H01L 27/10814 (2013.01); H01L 27/10823 (2013.01); H01L 27/10876 (2013.01); H01L 27/228 (2013.01); H01L 27/2436 (2013.01); H01L 29/66621 (2013.01); H01L 21/28518 (2013.01); H01L 27/10855 (2013.01); H01L 27/10888 (2013.01); H01L 43/08 (2013.01); H01L 45/06 (2013.01); H01L 45/08 (2013.01); H01L 45/1233 (2013.01); H01L 45/144 (2013.01);
Abstract

Semiconductor devices are provided including a substrate defining a gate trench. A buried gate structure is provided in the gate trench and at least fills the gate trench. The buried gate structure includes a gate insulation layer pattern, a gate electrode and a capping layer pattern. First and second impurity regions are provided at portions of the substrate adjacent to the buried gate structure, respectively. At least a portion of each of the first and second impurity regions face a sidewall of the buried gate structure. First and second buried contact structures are provided on the first and second impurity regions, respectively. Each of the first and second buried contact structures includes a metal silicide pattern and a metal pattern, and at least a portion of each of the first and second buried contact structures face to a sidewall of the buried gate structure.


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