The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Jul. 01, 2005
Applicant:
Shigeru Hirata, Kyoto, JP;
Inventor:
Shigeru Hirata, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/62 (2006.01); H01L 23/58 (2006.01); H01L 27/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/585 (2013.01); H01L 24/06 (2013.01); H01L 27/0251 (2013.01); H01L 27/0292 (2013.01); H01L 2224/05554 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/3011 (2013.01);
Abstract
A semiconductor device has a supply pad to which a supply voltage is fed, a supply conductor that is electrically connected to the supply pad, an input/output pad via which a signal is fed in from outside or fed out to outside, an electrostatic protection device that is electrically connected to the input/output pad and that is electrically connected via the supply conductor to the supply pad, and an internal circuit that is electrically connected via a signal conductor to the input/output pad. The electrostatic protection device, the input/output pad, and the internal circuit are arranged in this order from edge to center of the semiconductor device.