The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Dec. 30, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Michael J. Shapiro, Austin, TX (US);

John A. Fitzsimmons, Poughkeepsie, NY (US);

Natalia Borjemscaia, Wappingers Falls, NY (US);

Assignee:

GLOBALFOUNDRIES INC, Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/76879 (2013.01); H01L 21/76883 (2013.01); H01L 21/76898 (2013.01); H01L 23/528 (2013.01);
Abstract

The disclosure generally relates to semiconductor structures and, more particularly, to electrical connections used with crackstop structures and methods of manufacture. The structure includes: a conductive material; a dielectric material formed over the conductive material; a non-corrosive conductive material in at least one opening of the dielectric material and in direct contact with the conductive material; a crackstop structure formed over the dielectric material; and at least one of wiring layer in contact with the non-corrosive conductive material.


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