The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Sep. 09, 2015
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Ming Hu, Yokkaichi, JP;

Toshiyuki Takewaki, Yokkaichi, JP;

Seiichi Omoto, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 31/036 (2006.01); H01L 31/112 (2006.01); H01L 23/532 (2006.01); H01L 27/11582 (2017.01); H01L 27/1157 (2017.01);
U.S. Cl.
CPC ...
H01L 23/53271 (2013.01); H01L 27/1157 (2013.01); H01L 27/11582 (2013.01);
Abstract

According to an embodiment, a semiconductor memory device comprises: a memory string comprising a plurality of memory cells connected in series therein; and a contact electrically connected to one end of the memory string. The memory string comprises a plurality of control gate electrodes, and a semiconductor layer. The contact comprises a contact layer, the contact layer having a plate-like shape whose longer direction is a first direction parallel to the substrate, and the contact layer having its lower surface electrically connected to the one end of the semiconductor layer. Moreover, the contact layer includes a metal layer, a silicon based layer, and a second conductive layer. The metal layer includes tungsten. The silicon based layer includes a material including silicon. The second conductive layer covers side surfaces of the metal layer and the silicon based layer.


Find Patent Forward Citations

Loading…