The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9812382 B1

Expired

Date of Patent:

Nov. 07, 2017

Filed:

Sep. 22, 2016

Semiconductor device with lead terminals having portions thereof extending obliquely

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Kazutaka Shibata, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Alexander Oscar Williams

Int. Cl.

CPC ...

H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);

U.S. Cl.

CPC ...

H01L 23/49548 (2013.01); H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/495 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 24/49 (2013.01); H01L 24/48 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/451 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/85399 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01);

Abstract

A semiconductor device includes a semiconductor chip and a plurality of leads. The leads include a first lead including a supporting portion for mounting the semiconductor chip, and a projecting portion which projects in a first direction from the supporting portion. A second lead extends in a second direction non-parallel with the first direction, and one or more third leads extends in the second direction, such that a line extending in a third direction perpendicular to the first direction passes through the second lead and the one or more third leads. The second lead includes a first portion and a second portion, the first portion having a width larger than the second portion, the first portion having one side parallel to the first direction, and the first portion located between the second portion and the first lead.

Find Patent Forward Citations

Shibata, Kazutaka. (2017). Semiconductor device with lead terminals having portions thereof extending obliquely (U.S. Patent No. 9812382). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9812382

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile