The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Feb. 01, 2016
Applicant:

Ii-vi Incorporated, Saxonburg, PA (US);

Inventors:

Wen-Qing Xu, Medfield, MA (US);

Chao Liu, Butler, PA (US);

Giovanni Barbarossa, Saratoga, CA (US);

Elgin E. Eissler, Renfrew, PA (US);

Thomas E. Anderson, Morristown, NJ (US);

Charles J. Kraisinger, Saxonburg, PA (US);

Norbert Lichtenstein, Langnau a. Albis, CH;

Assignee:

II-VI Incorporated, Saxonburg, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 33/64 (2010.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3732 (2013.01); H01L 23/3736 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01L 24/83 (2013.01); H01L 33/641 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 25/0655 (2013.01); H01L 33/642 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/40139 (2013.01); H01L 2224/40151 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/8347 (2013.01); H01L 2224/8348 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83438 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83463 (2013.01); H01L 2224/83466 (2013.01); H01L 2224/83469 (2013.01); H01L 2224/83471 (2013.01); H01L 2224/83479 (2013.01); H01L 2224/83484 (2013.01); H01L 2224/83493 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01);
Abstract

A composite substrate includes a submount substrate of an alternating pattern of electrically insulative portions, pieces, layers or segments and electrically conductive portions, pieces, layers or segments, and a shaft, back or plate for supporting the alternating pattern of electrically insulative portions and electrically conductive portions. An active device having a P-N junction can be mounted on the submount substrate. The electrically insulative portions, pieces, layers or segments can be formed from diamond while the electrically conductive portions, pieces, layers or segments can be formed from a metal or metal alloy.


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