The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Jun. 27, 2016
Applicant:
Mstar Semiconductor, Inc., Hsinchu Hsien, TW;
Inventors:
Ming-Chung Chang, Hsinchu County, TW;
Tzu Wei Liu, Hsinchu County, TW;
Assignee:
MSTAR SEMICONDUCTOR, INC., Hsinchu Hsien, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); G06K 9/00 (2006.01); H01L 23/498 (2006.01); H01L 23/16 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0002 (2013.01); H01L 23/4985 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48235 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/157 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A capacitive sensor structure includes: a substrate; a multilayer wire structure, disposed on the substrate to form a passive sensing circuit; and a semiconductor chip, formed thereon a control circuit, fixedly mounted on a surface of the substrate and electrically connected to the multilayer wire structure.