The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Aug. 22, 2014
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Takashi Itaya, Kanagawa, JP;

Shogo Shinkai, Kanagawa, JP;

Hiroto Kawaguchi, Kanagawa, JP;

Fumihiko Iida, Kanagawa, JP;

Hayato Hasegawa, Kanagawa, JP;

Kei Tsukamoto, Kanagawa, JP;

Takayuki Tanaka, Kanagawa, JP;

Tomoko Katsuhara, Kanagawa, JP;

Tomoaki Suzuki, Kanagawa, JP;

Taizo Nishimura, Kanagawa, JP;

Hiroshi Mizuno, Kanagawa, JP;

Yasuyuki Abe, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G06F 3/0488 (2013.01); G06F 3/041 (2006.01); G06F 3/047 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); G06F 3/047 (2013.01); G06F 3/0414 (2013.01); G06F 2203/04102 (2013.01);
Abstract

There is provided a sensor device that includes a flexible first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at capacitively coupled portions of the first and second electrode wires, and a flexible substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.


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