The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Aug. 18, 2014
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Yangbin Chen, Lima, NY (US);

Manuela Ocampo, Corning, NY (US);

Ruchi Tandon, Painted Post, NY (US);

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/02 (2006.01); C08G 18/75 (2006.01); C08G 18/48 (2006.01); C08G 18/04 (2006.01); C09D 175/16 (2006.01); G02B 1/14 (2015.01); C03C 25/10 (2006.01); C08G 18/67 (2006.01);
U.S. Cl.
CPC ...
G02B 6/02395 (2013.01); C03C 25/106 (2013.01); C08G 18/04 (2013.01); C08G 18/4825 (2013.01); C08G 18/672 (2013.01); C08G 18/758 (2013.01); C09D 175/16 (2013.01); G02B 1/14 (2015.01);
Abstract

Fiber coatings with low Young's modulus and high tear strength are realized with coating compositions that include an oligomeric material formed from an isocyanate, a hydroxy acrylate compound and a polyol. The oligomeric material includes a polyether urethane acrylate and a di-adduct compound, where the di-adduct compound is present in an amount of at least 2.35 wt %. The reaction mixture used to form the oligomeric material may include a molar ratio of isocyanate:hydroxy acrylate:polyol of n:m:p, where n may be greater than 3.0, m may be between n−1 and 2n−4, and p may be 2. Young's modulus and tear strength of coatings made from the compositions increase with increasing n. Coatings formed from the present oligomers feature high tear strength for a given Young's modulus.


Find Patent Forward Citations

Loading…