The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Oct. 08, 2014
Applicant:

Wistron Corporation, New Taipei, TW;

Inventors:

Hao-Chun Hsieh, New Taipei, TW;

Hsin-Lun Tsai, New Taipei, TW;

Kaun-Chang Wu, New Taipei, TW;

Assignee:

Wistron Corporation, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 1/16 (2006.01); G01K 1/14 (2006.01); G01K 13/00 (2006.01); G01K 7/02 (2006.01); G01K 1/20 (2006.01);
U.S. Cl.
CPC ...
G01K 1/14 (2013.01); G01K 1/20 (2013.01); G01K 7/02 (2013.01); G01K 7/021 (2013.01); G01K 13/00 (2013.01);
Abstract

A temperature measuring board for use in measuring an oven temperature of a reflow oven includes a modular substrate and a thermal compensation unit. The modular substrate includes a plurality of substrates assembled to each other. Each substrate has at least one first fixing portion, and at least one second fixing portion removably fixed to the first fixing portion of another substrate. A selected number of the substrates can be assembled to each other to form a desired shape of the modular substrate through engagement of the first and second fixing portions. The thermal compensation unit includes at least one surface-measured compensation member fixed to the modular substrate at a selected location.


Find Patent Forward Citations

Loading…