The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Apr. 08, 2010
Seigi Aoyama, Kitaibaraki, JP;
Toru Sumi, Hitachi, JP;
Shuji Sakai, Tsuchiura, JP;
Takahiro Sato, Hitachi, JP;
Hidenori Abe, Hitachi, JP;
Seigi Aoyama, Kitaibaraki, JP;
Toru Sumi, Hitachi, JP;
Shuji Sakai, Tsuchiura, JP;
Takahiro Sato, Hitachi, JP;
Hidenori Abe, Hitachi, JP;
HITACHI METALS, LTD., Tokyo, JP;
Abstract
A dilute copper alloy material includes, based on a total mass of the dilute copper alloy material, 2 to 12 mass ppm of sulfur, 2 to 30 mass ppm of oxygen, 4 to 55 mass ppm of titanium, and a balance of pure copper and inevitable impurity. A part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO, TiS or Ti—O—S, and an other part of the sulfur and the titanium forms a solid solution. TiO, TiO, TiS and Ti—O—S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are 500 nm or less in particle size.