The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Nov. 13, 2014
Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Shusuke Yoshihara, Osaka, JP;

Syoji Ubukata, Osaka, JP;

Kazuaki Matsumoto, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 64/00 (2006.01); C09K 5/14 (2006.01); C08K 3/04 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/38 (2006.01); C08G 63/185 (2006.01); C08G 63/193 (2006.01); C08G 63/78 (2006.01); C08J 5/18 (2006.01); C08K 7/18 (2006.01); C08G 63/02 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08G 63/185 (2013.01); C08G 63/193 (2013.01); C08G 63/78 (2013.01); C08J 5/18 (2013.01); C08K 3/04 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/38 (2013.01); C08K 7/18 (2013.01); C08J 2367/02 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/282 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01);
Abstract

The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.


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