The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Jan. 13, 2015
Canon Kabushiki Kaisha, Tokyo, JP;
Keiji Matsumoto, Kawasaki, JP;
Jun Yamamuro, Yokohama, JP;
Kazuhiro Asai, Kawasaki, JP;
Kunihito Uohashi, Yokohama, JP;
Seiichiro Yaginuma, Kawasaki, JP;
Masahisa Watanabe, Yokohama, JP;
Koji Sasaki, Nagareyama, JP;
Ryotaro Murakami, Yokohama, JP;
Kenji Fujii, Yokohama, JP;
CANON KABUSHIKI KAISHA, Tokyo, JP;
Abstract
A method of manufacturing a structure includes (1) positioning a first resin layer provided on a first supporting member on a substrate having a through hole, with the first resin layer facing toward the substrate, and releasing the first supporting member from the first resin layer; and (2) positioning a second resin layer provided on a second supporting member on the first resin layer from which the first supporting member has been released, with the second resin layer facing toward the first resin layer, and releasing the second supporting member from the second resin layer. A first resin layer portion that is above the through hole is removed before or simultaneously with the releasing of the first supporting member.