The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Aug. 16, 2016
Applicants:

Raymond Miller Karam, Santa Barbara, CA (US);

Thomas Wynne, Santa Barbara, CA (US);

Anthony Thomas Chobot, Goleta, CA (US);

Inventors:

Raymond Miller Karam, Santa Barbara, CA (US);

Thomas Wynne, Santa Barbara, CA (US);

Anthony Thomas Chobot, Goleta, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); B32B 43/00 (2006.01); B32B 38/00 (2006.01); B01L 3/00 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); B01L 3/50273 (2013.01); B32B 38/0008 (2013.01); B32B 38/0036 (2013.01); B32B 43/00 (2013.01); B01L 2200/0689 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0887 (2013.01); B01L 2400/0481 (2013.01); B32B 2310/00 (2013.01); B32B 2439/80 (2013.01); B32B 2535/00 (2013.01); Y10T 156/1195 (2015.01); Y10T 156/1972 (2015.01);
Abstract

Embodiments generally relate to apparatus and methods for dismantling a hermetically sealed chamber. In one embodiment, an apparatus facilitating the opening of a hermetically sealed chamber in a device comprises a fixture configured to hold the device, and a system configured to create sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. In one embodiment, a method for opening a hermetic seal between first and second elements forming a chamber in a microfluidic chip comprises using a release technique creating sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. The release technique comprises introducing a tool to the vicinity of the interface without any contact between the tool and any material within the chamber. The breaking of the seal results in the complete separation of the first and second elements.


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