The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Aug. 01, 2014
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Martin Gerhaeusser, Brackenheim-Stockheim, DE;

Giuseppe Barone, Ludwigsburg, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01); H05K 3/20 (2006.01); B29K 705/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14639 (2013.01); B29C 45/1671 (2013.01); H01L 21/4821 (2013.01); H01L 23/49534 (2013.01); H01L 23/49541 (2013.01); B29K 2705/00 (2013.01); B29K 2995/0005 (2013.01); B29K 2995/0007 (2013.01); B29L 2031/3493 (2013.01); H01L 2924/0002 (2013.01); H05K 3/202 (2013.01); H05K 2201/09118 (2013.01);
Abstract

An encapsulated lead frame has a core element with multiple elongated conductor tracks arranged next to one another. The lead frame also has first partial encapsulations formed by a first encapsulation of the core element in first sub-regions and second partial encapsulations formed by a second encapsulation of the core element in second sub-regions. The first and second partial encapsulations enclose the core element as an overall encapsulation. The first partial regions are spaced apart from one another and each of the first partial encapsulations respectively surrounds only one single conductor track. This configuration avoids gaps that may form at interfaces between a first and second partial encapsulation, may extend between two adjacent conductor tracks, and may allow conductive fluid to accumulate therein and form short-circuits between adjacent conductor tracks. The encapsulated frame is used in a transmission control device. A method for producing an encapsulated lead frame is disclosed.


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