The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Jan. 12, 2016
Applicant:

The Procter & Gamble Company, Cincinnati, OH (US);

Inventors:

Darrell Ian Brown, Mason, OH (US);

John Andrew Strasemeier, Aurora, IN (US);

Assignee:

The Procter & Gamble Company, Cincinnati, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05C 13/00 (2006.01); B05C 5/02 (2006.01); A61F 13/531 (2006.01); A61F 13/15 (2006.01); B05C 1/08 (2006.01); B05C 11/10 (2006.01);
U.S. Cl.
CPC ...
B05C 13/00 (2013.01); A61F 13/15593 (2013.01); A61F 13/531 (2013.01); B05C 5/0212 (2013.01); B05C 5/0254 (2013.01); B05C 1/0808 (2013.01); B05C 11/1002 (2013.01);
Abstract

Aspects of the methods and apparatuses herein involve applying fluids onto an advancing substrate. The apparatuses and methods herein may provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to an advancing substrate. The fluid application apparatus may include a slot die applicator and a substrate carrier. The slot die applicator may include a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip. And the substrate carrier may be adapted to advance the substrate past the slot die applicator as the slot die applicator discharges adhesive onto the substrate. In operation, when a first surface of the substrate is disposed on the substrate carrier, the substrate carrier advances a second surface of the substrate past the slot opening of the slot die applicator.


Find Patent Forward Citations

Loading…