The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Nov. 25, 2015
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Bernd Sporer, Augsburg, DE;

Klaus Weinmann, Augsburg, DE;

Oleg Schneider, Augsburg, DE;

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20154 (2013.01); H05K 5/0008 (2013.01); H05K 7/205 (2013.01);
Abstract

Disclosed herein are apparatuses and methods for the cooling of electronic components of a COM-Express module using an adapter module to become VITA-59 compliant module. The adapter module operatively and thermally couple to a modular computing device, e.g., the COM-Express compliant module, configured with a conduction-cooled plate to provide an additional path for conducting thermal energy generated from integrated circuit components located on the modular computing device. The adapter module includes dimensions and thicknesses to form a spatial gap between an assembled system having the adapter module, the cooling plate, and the modular computing device and a cooling surface of an external heat sink to which the assembled system couples. The spatial gap relative to the cooling plate provides clearance for the adapter module to elastically deform such that the surfaces of the assembly contacts the heat sink when the assembled system is coupled thereto.


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